Effect of Temperature, Atmosphere and Metals on the Thermal Degradation of Printed Circuit Boards
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http://hdl.handle.net/10045/44928
Title: | Effect of Temperature, Atmosphere and Metals on the Thermal Degradation of Printed Circuit Boards |
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Authors: | Ortuño García, Nuria | Conesa, Juan A. | Moltó Berenguer, Julia | Font, Rafael |
Research Group/s: | Residuos, Pirólisis y Combustión |
Center, Department or Service: | Universidad de Alicante. Departamento de Ingeniería Química | Universidad de Alicante. Instituto Universitario de Ingeniería de los Procesos Químicos |
Keywords: | Printed circuit board | Pyrolysis | Combustion | Dioxin |
Knowledge Area: | Ingeniería Química |
Issue Date: | 2014 |
Publisher: | Federal Environmental Agency |
Citation: | Organohalogen Compounds. 2014, 76: 194-197 |
Abstract: | The permanent expansion of the market of electrical and electronic equipment (EEE) and the shorter innovation cycles, lead to a faster replacement of these appliances, making EEE a fast-growing source of waste (WEEE). As stated in Directive 2012/19/EU1 on waste electrical and electronic equipment, the content of hazardous components in EEE is a major concern during the waste management phase, and recycling of WEEE is not currently undertaken to a sufficient extent, resulting in a loss of valuable resources. |
Sponsor: | Support for this work was provided by: Ministry of Education and Science (Spain) (CTQ2008-05520 project); Valencian Community Government (Spain) (PROMETEO/2009/043/FEDER project). |
URI: | http://hdl.handle.net/10045/44928 |
ISSN: | 1026-4892 |
Language: | eng |
Type: | info:eu-repo/semantics/article |
Rights: | © Organohalogen Compounds |
Peer Review: | si |
Appears in Collections: | INV - REMAN - Artículos de Revistas INV - I4CE - Artículos de Revistas |
Files in This Item:
File | Description | Size | Format | |
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668_pcb_thermal_degradation.pdf | 812,9 kB | Adobe PDF | Open Preview | |
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