Improvement of multilayer plastic delamination using surface modification

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Title: Improvement of multilayer plastic delamination using surface modification
Authors: Berkane, Imene | Aracil, Ignacio | Fullana, Andres
Research Group/s: Ingeniería para la Economía Circular (I4CE)
Center, Department or Service: Universidad de Alicante. Departamento de Ingeniería Química | Universidad de Alicante. Instituto Universitario de Ingeniería de los Procesos Químicos
Keywords: Microperforation (µP) | Abrasion | Delamination | Metalized multilayer flexible packaging
Issue Date: 16-Dec-2023
Publisher: Elsevier
Citation: Resources, Conservation and Recycling. 2024, 202: 107357. https://doi.org/10.1016/j.resconrec.2023.107357
Abstract: Multilayer flexible packaging waste (MFPW) represents a critical issue in the field of waste management. The heterogeneous composition of this type of plastic makes its recyclability challenging. In this context, the delamination process appears to be a promising way to recycle the polymers layers separately. However, this process is still limited for a few MFPW. This work propose an innovative way to improve the delamination process using three surface modification techniques (mechanical and laser microperforation (µP), and abrasion) on the MFPW surface in order to accelerate the diffusion of the dissolving agent. The delamination was tested in a 10 % sodium hydroxide solution at 25ºC. Under this study, the mechanical µP and the abrasion gave the best results of delamination compared to the laser µP (total delamination in 25 min vs 45 min, respectively). It was concluded that the distance between the microholes was an important factor in both µP techniques.
Sponsor: Support for this work was granted by PID2019–105359RB-I00 project from the Ministry of Science and Innovation of Spain.
URI: http://hdl.handle.net/10045/139707
ISSN: 0921-3449 (Print) | 1879-0658 (Online)
DOI: 10.1016/j.resconrec.2023.107357
Language: eng
Type: info:eu-repo/semantics/article
Rights: © 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
Peer Review: si
Publisher version: https://doi.org/10.1016/j.resconrec.2023.107357
Appears in Collections:INV - I4CE - Artículos de Revistas

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